09 Jun 2021 Secure Sub-System in System-on-Chip (3S in SoC) Protection Profile
Eurosmart Technical group, ITSC, has developed a Protection Profile for Secure Sub-System in System-on-Chip (3S in SOC)
Modern System-on-Chip (SoC) products integrate more and more advanced functions, including security. Security Sub-System is also being integrated into the SoC (integrated Secure Element / eUICC).
The target is EAL 4+ (augmented with ALC_DVS.2 , ATE_DPT.2 and AVA_VAN.5).
The main differences with BSI-CC-PP-0084-2014 (Security IC Platform Protection Profile with Augmentation Packages) are:
• Support of external volatile and non-volatile memories (supplement to PP0084 Augmentation Package: External NVM Storage)
• Physical and/or logical isolation with other SoC components.
• Root-of-Trust functionality.
• Support of composite software isolation.
The presented version of the 3S PP in SOC document is under evaluation and certification process, scheduled to be accomplished in Q3 2021.
You can provide your feedback to support the implementation of the protection profile.draft_3S_PP_v1_0